Characterization of the silicon sensors & hexagonal PCB for HGCAL
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IPE
Lecture to the master thesis from Gizem Gül Dinçer, PhD candidate, on the Topic: Characterization of the silicon sensors & hexagonal PCB for HGCAL
The Large Hadron Collider at CERN is undergoing an upgrade to become the High Luminosity Large Hadron Collider (HL-LHC), with the planned instantaneous luminosity set to be 7.5 times higher than the nominal value (L = 10^34 cm^(-2) s^(-1)). As part of this upgrade project, the CMS collaboration is replacing its existing endcap calorimeters with a high-granularity calorimeter (HGCAL). HGCAL, being a sampling calorimeter, consists of both electromagnetic and hadronic compartments. Silicon sensors have been chosen as one of the active materials for the regions of HGCAL exposed to higher radiation levels. Several thousand 20 cm (8”) wide hexagonal wafers, produced in Japan by Hamamatsu, have been shipped to CERN after undergoing in-situ testing. In this presentation, I will provide an overview of the electrical characterization of the silicon sensors tested at CERN.
Lecture language: English
Frank Simon