DTS-ST3 Meeting

Session

Technology Focus

Mar 17, 2022, 2:10 PM

Description

A 'technology focus' more in-depth seminar on various aspects of bump- and wire-bonding. From basics for graduate students and postdocs to updates on newest
methods & possibilities

1. Aluminum Wire Bonding & Aluminum Tab-Bonding

Carmen Simons (GSI Helmholtzzentrum)

3/17/22, 2:10 PM

2. Gold Stud-Bonding & Bump-Bonding

Michele Caselle (KIT)

3/17/22, 2:40 PM

3. Packaging Technologies at DESY - Flip-Chip Mounting

Sumera Kousar (DESY)

3/17/22, 3:10 PM