DTS-ST3 Meeting

Thursday Mar 17, 2022, 1:30 PM → 5:30 PM Europe/Berlin

https://gsi-fair.zoom.us/j/67565257169

Meeting-ID: 675 6525 7169

Kenncode: DTS-ST3

1 Welcome

Speakers: Christian Joachim Schmidt (GSI Helmholtzzentrum für Schwerionenforschung GmbH(GSI)), Cornelia Wunderer (Desy)

Technology Focus: Bonding Technologies for Interconnect

A 'technology focus' more in-depth seminar on various aspects of bump- and wire-bonding. From basics for graduate students and postdocs to updates on newest
methods & possibilities

2 Aluminum Wire Bonding & Aluminum Tab-Bonding

Speaker: Carmen Simons (GSI Helmholtzzentrum)

Aluminum_wirebonding_csimons.pptx

3 Gold Stud-Bonding & Bump-Bonding

Speaker: Michele Caselle (KIT)

MT_ST3_workshop_Caselle_2022.pdf

4 Packaging Technologies at DESY - Flip-Chip Mounting

Speaker: Sumera Kousar (DESY)

Flip_Chip_Packaging_DESY.pdf

3:40 PM Break

Ideas and Questions

5 The data & infrastructure density challenge in (ultra) high speed imagers' (with CoRDIA as example)

Speaker: Ulrich Trunk (Desy)

CoRDIA_Density_Challenge.pdf

6 Micro-Channel Cooling and related MEMS Technologies

Speaker: Michael Deveaux (GSI Helmholzzentrum)

Micro Channel Cooling Deveaux - INDICO.pptx

Milestone Progress

7 Performance measurements of CdZnTe detectors for the MeV Cube

Speaker: Markus Ackermann (DESY-Zeuten)

dts-st3-mevcube.pdf