DTS-ST3 Meeting
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Europe/Berlin
Description
https://gsi-fair.zoom.us/j/67565257169
Meeting-ID: 675 6525 7169
Kenncode: DTS-ST3
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2:00 PM
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2:05 PM
Welcome 5mSpeakers: Christian Joachim Schmidt (GSI Helmholtzzentrum für Schwerionenforschung GmbH(GSI)), Cornelia Wunderer (Desy)
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2:10 PM
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3:40 PM
Technology Focus: Bonding Technologies for Interconnect
A 'technology focus' more in-depth seminar on various aspects of bump- and wire-bonding. From basics for graduate students and postdocs to updates on newest
methods & possibilities-
2:10 PM
Aluminum Wire Bonding & Aluminum Tab-Bonding 30mSpeaker: Carmen Simons (GSI Helmholtzzentrum)
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2:40 PM
Gold Stud-Bonding & Bump-Bonding 30mSpeaker: Michele Caselle (KIT)
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3:10 PM
Packaging Technologies at DESY - Flip-Chip Mounting 30mSpeaker: Sumera Kousar (DESY)
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2:10 PM
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3:40 PM
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4:00 PM
Break 20m
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4:00 PM
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5:00 PM
Ideas and Questions
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4:00 PM
The data & infrastructure density challenge in (ultra) high speed imagers' (with CoRDIA as example) 30mSpeaker: Ulrich Trunk (Desy)
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4:30 PM
Micro-Channel Cooling and related MEMS Technologies 30mSpeaker: Michael Deveaux (GSI Helmholzzentrum)
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4:00 PM
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5:00 PM
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5:20 PM
Milestone Progress
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5:00 PM
Performance measurements of CdZnTe detectors for the MeV Cube 20mSpeaker: Markus Ackermann (DESY-Zeuten)
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5:00 PM
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2:00 PM
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2:05 PM