Name: DTS-ST3 Meeting
Start: 2022-03-17T13:30:00+01:00
End: 2022-03-17T17:30:00+01:00
Location: No location set

- 1
  
  Welcome
  
  Speakers: Christian Joachim Schmidt (GSI Helmholtzzentrum für Schwerionenforschung GmbH(GSI)), Cornelia Wunderer (Desy)
- Technology Focus: Bonding Technologies for Interconnect
  
  A 'technology focus' more in-depth seminar on various aspects of bump- and wire-bonding. From basics for graduate students and postdocs to updates on newest
  methods & possibilities
  - 2
    
    Aluminum Wire Bonding & Aluminum Tab-Bonding
    
    Speaker: Carmen Simons (GSI Helmholtzzentrum)
    
    Aluminum_wirebonding_csimons.pptx
  - 3
    
    Gold Stud-Bonding & Bump-Bonding
    
    Speaker: Michele Caselle (KIT)
    
    MT_ST3_workshop_Caselle_2022.pdf
  - 4
    
    Packaging Technologies at DESY - Flip-Chip Mounting
    
    Speaker: Sumera Kousar (DESY)
    
    Flip_Chip_Packaging_DESY.pdf
- 3:40 PM
  
  Break
- Ideas and Questions
  - 5
    
    The data & infrastructure density challenge in (ultra) high speed imagers' (with CoRDIA as example)
    
    Speaker: Ulrich Trunk (Desy)
    
    CoRDIA_Density_Challenge.pdf
  - 6
    
    Micro-Channel Cooling and related MEMS Technologies
    
    Speaker: Michael Deveaux (GSI Helmholzzentrum)
    
    Micro Channel Cooling Deveaux - INDICO.pptx
- Milestone Progress
  - 7
    
    Performance measurements of CdZnTe detectors for the MeV Cube
    
    Speaker: Markus Ackermann (DESY-Zeuten)
    
    dts-st3-mevcube.pdf